| 摘要 |
PURPOSE: To provide an abrasive cloth with which can be easily corrected non-uniformity of polishing can be polished a polishing object with an objective part emphasized. CONSTITUTION: In an abrasive cloth 4 provided on a turn table 1 brought into contact with a polishing object held to a top ring to polish a surface of the polishing object, a region 4a having an elastic coefficient different from that in the periphery is formed in a contact surface with the polishing object of the abrasive cloth 4, and in the case that the region 4a is brought into contact with a semiconductor wafer 2, length in a diametric direction of the turn table in a contact part of the region 4a is smaller than a diameter of the semiconductor wafer 2, to determine a position of the region 4a based on an acting region in the semiconductor wafer 2 of the region 4a. |
