| 摘要 |
A method for manufacturing a substrate having electrically conductive circuits on its surface, window-shaped films on the electrically conducive circuits and a frame-shaped film at the regions not occupied with the window-shaped films, includes the steps of: (a) coating the surface of a transparent substrate with a photoresist composition to cover the electrically conductive circuits-carrying surface of the substrate, followed by forming a photoresist film, (b) superposing a photomask on the surface of the photoresist film formed in step (a) and exposing the thus mask-superposed photoresist film to light, (c) subjecting the substrate obtained in step (b) to development, (d) subjecting the photoresist film left in step (c) to heat-treatment, second exposure to light or no treatment, (e) subjecting the substrate passed the steps (a) to electro-deposition using the electrically conductive circuits on the substrate as one electrode to form electro-deposition coating films, (f) eliminating the photoresist film having been subjected to heat-treatment, second exposure to light or no treatment in step (d) and leaving the electro-deposition coating films formed in step (e), (g) coating the whole surface of the transparent substrate passed the steps (a) to (f) in this order with a negative photoresist composition to cover the electrically conductive circuits-carrying surface of the substrate, followed by forming a functional coating film, (h) exposing the surface opposite to the electrically conductive circuits-carrying surface of the transparent substrate passed the steps (a) to light, and (i) eliminating the uncured parts irrespective of step (h) from the functional coating film.
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