| 摘要 |
A system for coating a photoresist on a semiconductor wafer includes a loading/unloading unit and a process unit. A convey path is arranged in the process unit, and an adhesion process section, a pre-bake section, a cooling section, a resist coating section, and a cover film coating section are arranged along the convey path. The adhesion process section, the pre-bake section, and the cover film coating section are arranged in individual process chambers, while the cooling section and the resist coating section are arranged in a common main process chamber. A convey robot is disposed to be movable along the convey path, and a substrate is conveyed among the process chambers by the convey robot. A convey member is arranged in and dedicated to the main process chamber, and the substrate is conveyed from the cooling section to the-resist coating section by the convey member.
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