| 摘要 |
PROBLEM TO BE SOLVED: To provide a new improved process for manufacturing multi-chip packages. SOLUTION: A multi-chip package, provided with an aluminum silicon substrate 10 having an aluminum nitride layer 11, on which an electrically separated surface 11 is formed and a heat conductive region 12 of aluminum allocated on the insulating layer 11, is manufactured. A conductor on the surface 11 of the substrate 10 provides a mounting region 13, each mounting region 13 being allocated, while adjoining a region among related heat conductive regions 12, and an external connection to a semiconductor chip 25 mounted in each mounting region 13. A heat conductive element 26 is connected to the rear surface of each chip 25 and one region among related thermally-conductive regions 12, with each chip 25 encapsulated with reworkable encapsulant. |
