| 摘要 |
A power supply apparatus includes first and second spaced-apart, substantially parallel panels, and a chassis disposed in substantially perpendicular to and between the first and second panels. Opposite edges of the chassis are coupled to the respective ones of the first and second panels to thereby partition the space between the first and second panels into upper and lower regions. A power supply circuit includes heat-generating electric components disposed in the lower region, and non-heat-generating components disposed in the upper region. The chassis has an opening therein and a heat sink is mounted to close the opening in the chassis. A semiconductor module of the power supply circuit is mounted on the surface facing to the upper region of the heat sink. |
