Verfahren und Vorrichtung zur Naßbehandlung von Substraten in einem Behälter
摘要
Proposed is a method for wet-processing substrates in a vessel into which a liquid is fed and is removed again through an overflow device. The method is particularly simple to carry out if the overflow device floats on the liquid and descends and/or rises as the liquid surface descends and/or rises. No mechanical devices are needed to raise the substrates and remove them from the liquid. Also proposed are devices for the wet-processing of substrates by the method proposed.
申请公布号
DE19517573(A1)
申请公布日期
1996.11.14
申请号
DE1995117573
申请日期
1995.05.12
申请人
STEAG MICROTECH GMBH DONAUESCHINGEN, 78166 DONAUESCHINGEN, DE
发明人
DENZLER, LUDWIG, 75210 KELTERN, DE;HARMS-JANSSEN, HELMUTH, 75038 OBERDERDINGEN, DE