发明名称 METHOD AND APPARATUS FOR SURFACE-MOUNTING MULTI-LEGGED COMPONENTS
摘要 A device and method for applying receptacle contacts (39) on a printed circuit board or like substrate (15), to receive the multiple terminal leads of an integrated circuit, chip, or similar component. The device is formed integrally from a conductive strip with a carrier strip supporting a plurality of cup-like contacts on one or more edges of the carrier strip. Each contact includes an integral spring finger for contacting a lead inserted into the contact.
申请公布号 WO9636090(A1) 申请公布日期 1996.11.14
申请号 WO1996US07054 申请日期 1996.05.09
申请人 NORTH AMERICAN SPECIALTIES CORPORATION;SEIDLER, JACK 发明人 SEIDLER, JACK
分类号 H01R43/16;H05K3/32;H05K7/10;(IPC1-7):H01R9/24;H01R13/11;H05K3/34 主分类号 H01R43/16
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