Process and device for cleaning semiconductor wafers

摘要

Process for cleaning silicon wafers comprises introducing the wafers into a bath comprising an aq. HF cleaning soln. through which ozone is streamed, the HF concentration being 0.01-50%. 10<-6>-10% of a surfactant is added to the soln.. Also claimed is the appts. for carrying out the above process comprising a container to receive the silicon wafers and a bath of cleaning fluid. The appts. is novel in that the bottom (16) of the container (10) has at least one opening (18) for introduction of cleaning fluid, that a perforated floor (22) covering the cross-section of the container (10) is arranged at a distance above the opening (18) for distributing the cleaning fluid, and that the appts. has devices for supplying cleaning fluid to the opening (18).