METHOD AND DEVICE FOR TREATMENT

摘要

An exclusively used carrier (EQMC) containing wafers (EQMW) for monitoring heat-treatment equipment is housed on a carrier storing shelf (32). An equipment monitoring parameter setting section (62) sets the frequency at which wafers (EQMW) are transferred into a heat-treating furnace (21), the number of wafers on a wafer boat (23) and the positions where the wafers are placed on the wafer boat (23). For every period determined by the set frequency, the wafers (EQMW) are placed in dummy wafer holding areas (D) at both the upper and lower end sections of the board (23) and subjected to heat-treatment. After the heat-treatment the wafers (EQMW) are transferred to an inspecting device. The state of the heat-treatment equipment is recognized from the treated states of the wafers (EQMW). In such a way, during the treatment of semiconductor wafers with a batch type heat-treatment equipment, the state of the heat-treatment equipment is monitored using the monitoring wafers and, the operation of the heat-treatment equipment is facilitated.