| 摘要 |
PURPOSE: To eliminate use of a molding die for package molding by scanning while irradiating with light energy with a specified spot diameter to scan at an energy level which is necessary for setting a photosetting composition and forming a photosetting composition in a silicon element or a part of a silicon element and an outer lead. CONSTITUTION: A photosetting composition 8 is brought into contact with a silicon wafer 6 wherein an electrical circuit is formed or a silicon chip and an outer lead. A set matter of the photosetting composition 8 is formed in a sealing part and a periphery thereof by light energy irradiation of a spot diameter of at most 1000μm as a sealing layer. That is, a container is filled with the photosetting composition 8 with fluidity and photosetting energy irradiates a sealing part in a composition. Spot light with a fine spot diameter scans a surface of the photosetting composition 8 by an arbitrary pattern in this way. The pattern can be readily created by changing strength and scanning velocity, etc., of light energy. |
