发明名称 MANUFACTURE OF SHEET CIRCUIT ELEMENT AND SHEET CIRCUIT ELEMENT
摘要 <p>PURPOSE: To improve the adhesion of wires between insulating sheets and the welding between the wires and corresponding connection parts. CONSTITUTION: Round wires 5 are bonded to an insulating sheet 7 and the round wires 5 are flattened by presses 13 and 14 in the direction of a sheet thickness. The round wires 5 are arranged into a circuit patter on a wiring board and the round wires 5 are transferred onto the one insulating sheet 7 and bonded to it. After the other insulating sheet 15 is placed on the round wires 5 and bonded to the insulating sheet 7, the wires 5 are flattened by the presses 13 and 14 in the direction of the sheet thickness to have flat shapes. Then the other insulating sheet 15 is bonded. The flat-shaped wires 5' are exposed through the connection holes formed in the insulating sheets 7 and 15 and the exposed wires in the connection holes are brought into contact with corresponding connection parts with large contact areas and securely welded.</p>
申请公布号 JPH08294213(A) 申请公布日期 1996.11.05
申请号 JP19950098511 申请日期 1995.04.24
申请人 YAZAKI CORP 发明人 OZAKI KEIICHI
分类号 H05K3/10;H02G3/16;(IPC1-7):H02G3/16 主分类号 H05K3/10
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