发明名称 LAYER FORMING METHOD BY CUTTING AND DEVICE THEREFOR
摘要 <p>PURPOSE: To form three dimensional shape material with high accuracy in a short time by fabricating plate members into three dimensional shape by a tool according to a three-dimensional machining program prepared for every layer on the basis of three-dimensional numerical data. CONSTITUTION: An adhesive is applied to the lower face of a second stage plate member 7 by an adhesive applying device 120 arranged on the way of conveyance. A table 114 is then moved up by a z-axis driving feed motion, and the upper face of a first stage plate member 2 through with machining is pressed to the lower face of the second stage plate member 7. In association with this, the second stage plate member 7 and the first stage plate member 2 through with machining on the upper face of the table 114 are integrally layered with the adhesive 8. After the suction force of a suction pad 122 is released to lower the table 114, a plate carrier 119 is moved into a delivery position to a plate stocker 118. The second stage plate member 7 is then machined by a tool according to a three-dimensional machining program in a layer corresponding to the second plate member 7.</p>
申请公布号 JPH08290347(A) 申请公布日期 1996.11.05
申请号 JP19950120613 申请日期 1995.04.21
申请人 OSAKA KIKO CO LTD 发明人 OKAMOTO MITSURU;HONDA HISAYOSHI
分类号 B23Q15/00;B23Q35/00;B29C67/00;B32B37/00;(IPC1-7):B23Q15/00;B32B31/00 主分类号 B23Q15/00
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