发明名称 |
Conductive epoxy grid array semiconductor packages |
摘要 |
A semiconductor device assembly utilizing a grid array of conductive epoxy for connecting it to an electronic system. Conductive epoxy is screen printed in a desired pattern onto a printed wire board of the semiconductor device assembly. The conductive epoxy is B-staged by heating in an oven. The semiconductor device assembly is then placed onto a system printed circuit board wherein the B-staged conductive epoxy is further cured by heat and effectively makes mechanical and electrical connections between the semiconductor device assembly and the system printed circuit board.
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申请公布号 |
US5572069(A) |
申请公布日期 |
1996.11.05 |
申请号 |
US19950429627 |
申请日期 |
1995.04.27 |
申请人 |
LSI LOGIC CORPORATION |
发明人 |
SCHNEIDER, MARK |
分类号 |
H01L21/48;H01L23/498;H05K1/18;H05K3/12;H05K3/32;(IPC1-7):H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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