| 摘要 |
PURPOSE: To realize a method for manufacturing an electronic circuit in which solder connection with high reliability can be performed without using flux in the state that an electronic component is positioned on a circuit board and temporarily fixed. CONSTITUTION: When an electronic component 5 in which solder material 3 is previously supplied and a ceramic board 1 are solder connected fluxlessly, the surfaces of the material 3 and the connecting pattern 2 are cleaned, and a foreign matter 7 such as an oxide film or an organic contaminating film is removed or reduced. The organic material having a boiling point equal to the melting point of the solder or higher is so supplied as to cover the pattern 2 or the material 3, the component 5 is positioned on the board 1, and temporarily fixed. At the time of melting the solder, the connector is covered with the organic material to prevent the oxidation of the connector, and wettability of the solder is obtained. When material having hydroxyl group in a molecule is used as the material, the oxide of the solder surface can be preferably reduced to be removed. The solder may be supplied by the solder paste containing surface cleaned solder powder and the organic material as ingredients. |
