| 摘要 |
<p>PURPOSE: To improve the reliability of the inner lead bonding (ILB) in a multi- pin IC chip with 700 or more electrodes. CONSTITUTION: Inner leads 3 are aligned and superposed on a bump electrode 2, and after they are thermocompression bonded using a gang bonding jig 22 and they are tacked, each connecting point is permanently connected successively by heating using the ultrasonic vibration applied to a point bonding jig 23 and a bonding stage 21.</p> |
