| 摘要 |
PURPOSE: To accurately reduce the influence of jump data in a measured coordinate value regardless of the state of the detection signal of a wafer mark when calculating the array coordinates of a plurality of shot regions on a wafer by performing statistical processing of the measured coordinate values of a plurality of wafer marks. CONSTITUTION: The array coordinates of n alignment measurement points are measured (Steps 101 and 102), the reliability of each alignment data is obtained on the basis of the scattering of the difference (alignment data) from the design value of the measured array coordinates (Step 103), the values of conversion parameters A-F for obtaining the actual array coordinates are calculated from the array coordinates in terms of designing (Step 104), and the array coordinates of each shot region are obtained by the conversion parameters (Step 105). |
