发明名称 ELECTRONIC COMPONENT MOUNTING APPARATUS
摘要 PURPOSE: To prevent the damage of an electronic component and to improve the productivity by improving the suction rate of the component on a supply unit, and preventing the positional deviation after the component is mounted on an X-Y table. CONSTITUTION: The pressure applied to a nozzle when the nozzle for sucking an electronic component is brought into contact with the component is detected by a load cell 11. A main controller 14 controls an AC servo motor 17 based on the detected pressure value, controls the drop of the nozzle to control the pressure of the nozzle to eliminate the excess pressure to the component at the time of sucking or mounting the component.
申请公布号 JPH08288691(A) 申请公布日期 1996.11.01
申请号 JP19950088032 申请日期 1995.04.13
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NAKANO TOMOYUKI;INUZUKA RYOJI;TSUKUDA TAKEO;OE KUNIO
分类号 B23P21/00;B25J15/06;H05K13/04 主分类号 B23P21/00
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