| 发明名称 |
METHOD FOR FITTING SEMICONDUCTOR PELLET ON METAL BODY |
| 摘要 |
A method for fitting a semiconductor pellet on a metal substrate, welding preliminarily a gold disc on the surface of a nickel plate by the electric resistance welding method and thereafter alloying a silicon pellet with said gold disc under the eutectic temperature of gold-nickel.
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| 申请公布号 |
US3641663(A) |
申请公布日期 |
1972.02.15 |
| 申请号 |
USD3641663 |
申请日期 |
1968.09.27 |
| 申请人 |
HITACHI LTD. |
发明人 |
HIDERU OSOEGAWA;KATUEI KOBAYASHI |
| 分类号 |
H01L21/52;H01L21/00;H01L21/60;(IPC1-7):B01J17/00;H01L7/02;H01L7/16 |
主分类号 |
H01L21/52 |
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