发明名称 VIBRATION FUSION BONDED HOLLOW MOLDING MADE OF POLYAMIDE RESIN
摘要 PURPOSE: To obtain a vibration fusion bonded hollow molding made of polyamide resin which has small warpage, no decrease in fusion bonding strength and excellent external appearance. CONSTITUTION: The vibration fusion bonded hollow molding made of polyamide resin comprises (a) 0 to 89wt.% of polyamide resin having 2.5 to 4.0 of relative viscosity and 50mJ/mg or more of melting enthalpy, (b) 1 to 90wt.% of polyamide resin having 1.5 to 4.0 of relative viscosity and 50mJ/mg or less of melting enthalpy, (c) 10 to 60wt.% of glass fiber and (d) 0 to 30wt.% of platelike filler. A plurality of hollow products 4 molded by using the polyamide resin composition containing 40 to 90wt.% of the sum of the resins (a) and (b) and 10 to 60wt.% of the sum of the fiber (c) and the filler (d) is vibration fusion bonded.
申请公布号 JPH08281827(A) 申请公布日期 1996.10.29
申请号 JP19950109117 申请日期 1995.04.11
申请人 MITSUBISHI ENG PLAST KK 发明人 URABE HIROSHI;OYAMA HAJIME;HITOMI TATSUYA
分类号 B29C65/06;B29D22/00;B29K77/00;B29K105/06;B29L22/00;C08K7/14;C08L77/00 主分类号 B29C65/06
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