发明名称 RELEASE COMPOSITION
摘要 PURPOSE: To obtain a release compsn. which enables an easy separation of only a limited desired portion of an electonic part or circuit bonded with an adhesive while retaining reliability by compounding a highly polar solvent, an alcoholic soln. of an alkaline compd., and a thixotropy imparting agent powder. CONSTITUTION: The release compsn. is prepd. by compounding 100 pts.wt. solvent having a dipole moment of 1D or higher, 0.5-30 pts.wt. alcoholic soln. of an alkaline compd., and a thioxtropy imparting agent in an amt. of 5-30 pts.wt. based on 100 pts.wt. mixture of the solvent and the alcoholic soln. A pref. solvent is a nitrogen compd. having a b.p. of 90 deg.C or higher (e.g. N- methylpyrrolidone or N.N-dimethylformamide). An example of the soln. is a methanolic or ethanolic soln. of potassium hydroxide or tetramethylammonium hydroxide. The thixotropy imparting agent has a particle size of 50μm or lower, pref. 1μm or lower, examples being a fine cross-linked styrene resin powder and silica.
申请公布号 JPH08283792(A) 申请公布日期 1996.10.29
申请号 JP19950086752 申请日期 1995.04.12
申请人 HITACHI CHEM CO LTD 发明人 FUJINAWA MITSUGI;OTA TOMOHISA
分类号 C11D7/06;C11D7/32;C11D7/50;C23G5/02;(IPC1-7):C11D7/50 主分类号 C11D7/06
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