| 摘要 |
PURPOSE: To provide a mirror finished surface polishing method and a device for easily obtaining a wafer with a superior flat surface. CONSTITUTION: A plurality of adhering disk 2 are secured to a revolving guide disk 3 same as a revolving plate 5 for driving a pressing disk 4, a polishing table 8 is driven to turn by a polishing table-turning shaft 9, the adhering disk 2 rotates, pressed by a pressing disk 4, and the adhering disk 2 revolves through the guide disk 3, while a polishing solution is supplied onto a polishing pad 7, so that the mirror finished surface polishing of the surface of a wafer 1 might be performed. The present device for improving the flat level of the wafer 1 is characterised in that the disk 2 on which the wafer 1 is adhered is formed to have a ring-shape so as to decrease an adhesion area so that the shape of the disk 2 and the inclusions of foreign matters might have littke effect, the polishing pressure is loaded into an inner cavity of the adhering disk 2 through a controlled fluid or a gaseous matter as a medium, and the effect of edge-dulling phenomenon by the viscoelasticity of the polishing pad 7 is reduced by controlling the deformation degree of the protrusion of the wafer 1. |
