Semiconductor device having a contact plug and contact pad

摘要

A semiconductor device having a structure capable of obtaining an increased alignment margin for a mask without any increase in the area of the semiconductor device by forming a contact plug on a drain while forming a contact pad on a source without forming contact plugs on both the source and the drain in a simultaneous manner, and a method for fabricating the semiconductor device. The contact pad has an upper portion partially overlapping with a portion of an insulating film surrounding a contact hole in which the contact pad is buried. Accordingly, it is possible to easily carry out the contact process.