METHOD FOR SEALING A COMPONENT OF ELECTRONIC CIRCUIT IN COMPOUND, COMPONENTS OF ELECTRONIC CIRCUIT WITH PLASTIC HOUSING AND MOLD DEVICE WHICH IMPLEMENTS SAID METHOD

摘要

FIELD: electronics. SUBSTANCE: method involves putting component into mold, inserting film between component and walls, injection of compound material in chamber between component and film. Film provides possibility for easy separation from walls. Specific feature of method is use of film which side directed to component is better keyed to warm injected compound material which seals component than to film, so that it is keyed to plastic housing when latter is removed from mold after cooling. EFFECT: increased functional capabilities.