| 摘要 |
PURPOSE: To strengthen adhesive power by improving heat resistance by a method wherein metal is vapor deposited and/or a metal plated layer is formed on an aromatic polyimide layer containing a bendable bond in a principal chain of a multi-layer extruded polyimide film. CONSTITUTION: A polyimide film with a metallic film 1 of three layers is composed of a multi-layer extruded polyimide film (base material film) 2 and a metallic film 3. For the multi-layer extruded polyimide film 2, for example, preferably a precursor solution of a high heat resisting aromatic polyimide and a precursor of an aromatic polyimide having a bendable bond in a principal chain are extruded by a multi-layer extruding method, and thereafter, the obtained laminate is dried at 50-200 deg.C, and heat treated at 300 deg.C or higher, preferably at 300-500 deg.C. The multi-layer aromatic polyimide film having the aromatic polyimide layer with bendable bond in the principal chain on the surface which is manufactured thus, is exemplified. |
