发明名称 Air-dielectric transmission lines for integrated circuits
摘要 The present invention provides an interconnect structure which offers good mechanical stability and reduced charge concentration along the metal-insulator boundary corresponding to lower capacitance. The interconnect structure is comprised of a conductive transmission line structure and a transmission line support structure. The support structure has a "railway trestle-like" construction that provides a braced framework to support the transmission line with a greatly reduced effective dielectric constant. The trestle-like construction of the support structure is comprised of a membrane-like structure and supporting base structure separated by column-like support members. Spaces between the column-like support members form air pockets. The surface of the supporting base structure defines a horizontal axis. The long axis of the column-like support members are typically positioned at a 90 degree angle to the horizontal axis, thus defining a vertical axis support.
申请公布号 US5567982(A) 申请公布日期 1996.10.22
申请号 US19940316195 申请日期 1994.09.30
申请人 BARTELINK, DIRK J. 发明人 BARTELINK, DIRK J.
分类号 H01L21/768;H01L23/522;(IPC1-7):H01L29/41 主分类号 H01L21/768
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