| 摘要 |
<p>PURPOSE: To enhance the reliability upon junction by eliminating any not yet filled up part with a sealing resin by a method wherein a connecting electrode formed as if radially extending from one point on an element forming surface of an integrated circuit device is provided with a solder bump electrode. CONSTITUTION: A solder bump electrode 17 is formed on a connecting electrode pad formed as if radially expanding from one point on an element forming surface of an integrated circuit device 11. Next, the integrated circuit device 11 forming the solder bump electrode 17 is facedown connected to a substrate having wirings and connecting electrodes so as to seal up the gaps between the integrated circuit device 11 and the substrate with a sealing resin. Through these procedures, the not yet filled up parts with the sealing resin can be eliminated for enhancing the reliability upon junction thereby enabling the land numbers to be increased if the design rules are subject to any restrictions.</p> |
