发明名称 ELECTRONIC COMPONENT MOUNTING EQUIPMENT
摘要 PURPOSE: To accurately mount a component on a board without touching the component at all, by optically recognizing the component sucked by a suction head, adjusting the attitude of the component by rotating the suction head on the basis of the recognized data, and determining the position of an XY table. CONSTITUTION: An electronic component which is mounted by a head part A, subjected to taping, wound up on a reel 3 in this state, and accommodated is carried as far as just under a suction head 54 and sucked by a tape sending pin of a component supply part B, rotated intermittenly by an index unit 12, and sent to a visual recognition part E. The position is detected by a camera, and fed back to a control equipment, which gives a command of the position where the electronic component is mounted on a board 8 to a monitor of an XY table C, and moves it by setting transfer data to which the position deviation data from the visual recognition part E are added, as a command value. One pitch is again sent from an index unit 12, and the suction head 54 repreats the sequence.
申请公布号 JPH08279700(A) 申请公布日期 1996.10.22
申请号 JP19960111459 申请日期 1996.05.02
申请人 HITACHI LTD 发明人 FUJITA YASUHIRO;SUZUKI TAKAMICHI;KAWANA TAKESHI
分类号 B23P19/00;H05K13/04 主分类号 B23P19/00
代理机构 代理人
主权项
地址
您可能感兴趣的专利