MANUFACTURING METHOD OF MULTILAYER CERAMIC BOARD

摘要

PURPOSE: To improve the electric connection between through-hole conductors between ceramic layers having microinterconnections by entering a joining pattern for conductor patterns formed on the back side of an upper ceramic green sheet into paste sinks of a lower ceramic green sheet. CONSTITUTION: A joining pattern 9 is formed on the surface of an inner layer pad 8 formed at the lower part of a through-hole conductor 5 of an upper layer ceramic sheet 1a. The pattern 9 is printed on the surface of the pad 8 of the sheet 1a to be laminated on a lower ceramic green sheet 1b. When the sheets 1a and 1b are laminated and pressured, the pattern 9 is easy to enter into paste sinks 10, thereby avoiding flowing it over the pad 8 to adjacent interconnection patterns 7 whereby electric short circuit between both patterns 9 and 7 can be prevented.