SILVER BASED CONDUCTIVE PASTE, AND MULTILAYER CERAMIC CIRCUIT BOARD USING THE PASTE

摘要

PURPOSE: To provide a silver based conductive paste which prevents warpage of a board at the time of sintering, and a multilayer ceramic circuit board using the paste. CONSTITUTION: In a silver based conductive paste to be printed on a low temperature fired ceramic consisting of CaO-Al2 O3 -SiO2 -B2 O3 based glass and and Al2 O3 , silver based powder is in the range of a specific surface area 0.1 to 0.5m<2> /g, and a scratch mark measured by a grind gage measurement after being pasted by adding organic resin and an organic solvent is 10-30μm, A multilayer ceramic circuit board is provided by using the paste.