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发明名称
Vorrichtung und Verfahren um Halbleiterscheiben zu Kühlen
摘要
申请公布号
DE69213548(D1)
申请公布日期
1996.10.17
申请号
DE1992613548
申请日期
1992.05.15
申请人
APPLIED MATERIALS, INC., SANTA CLARA, CALIF., US
发明人
BAHNG, KENNETH J., CUPERTINO, CA 95014-4818, US
分类号
H01L21/683;H01L21/00;H01L21/687;(IPC1-7):H01L21/00
主分类号
H01L21/683
代理机构
代理人
主权项
地址
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