| 摘要 |
<p>An integrated circuit memory package comprises a plurality of integrated circuit assemblies (62) attached to a base (63), each assembly (62) comprises a flat substrate (31) having a plurality of contact terminals (33) arranged along a lower edge thereof and integrated circuit memory devices attached to respective opposite sides thereof (10R, 10S). The assemblies (62) are bonded to each other prior to attachment to the base (63), such that their respective lower edges are arranged in a plane which extends perpendicular to the substrates (31). The contact terminals (33) are connected to respective contact terminals (63) on the upper surface of the base (64) by means of a conductive butt joint. A good connection is formed between the substrates (31) and the base (64) because bonding the assemblies (62) together helps to ensure that the contact terminals (33) on each substrate (31) are aligned correctly with the corresponding terminals (63) on the base (64).</p> |
