| 发明名称 |
Semiconductor wafer polishing |
| 摘要 |
Reproducible polishing of semiconductor wafers and devices is obtained by adapting the polishing conditions in accordance with the ratio between an initial detected friction value and a friction value detected after a predetermined period of time. |
| 申请公布号 |
GB2299895(A) |
申请公布日期 |
1996.10.16 |
| 申请号 |
GB19960011070 |
申请日期 |
1993.05.26 |
| 申请人 |
KABUSHIKI KAISHA * TOSHIBA |
发明人 |
MASAKO * KODERA;ATSUSHI * SHIGETA;HIROMI * YAJIMA;HIROYUKI * YANO;RIICHIROU * AOKI;HARUO * OKANO |
| 分类号 |
B24B37/04;B24B49/00;B24B49/02;B24B49/04;B24B49/16;C09K3/14;H01L21/3105;H01L21/66;(IPC1-7):H01L21/304 |
主分类号 |
B24B37/04 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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