发明名称 WIRE SAW AND METHOD TO CUT WAFER FROM WORKPIECE
摘要 PROBLEM TO BE SOLVED: To compensate for the incorrect positions of wire segments when they are shifted off an intended cut face by observing the fluctuation of the positions of wire guide rollers for wire webs and the axial direction of bearing spindles of wire guide rollers. SOLUTION: Wire guide rollers 14a are connected with bearing spindles 19 through a flange 20 and a screw 21. Also, wire guide rollers 14a are connected with a measuring shaft 4a facing a measuring device 2a on their central sections in the axial direction. A measuring point for detecting the incorrect positions of wire segments of wire webs 13 are formed on an end face 4b of the measuring shaft 4a. When the distance to the end face 4b of the measuring shaft 4a measured by the measuring device 2a is deviated from the set distance, a compensating movement of the wire guide rollers 14a is carried out by an adjusting device 1. The movement of the wire segments of a workpiece demonstrated as the deviation of positions of the wire segments on the desired cut face can be detected and compensated by the arrangement.
申请公布号 JPH08267446(A) 申请公布日期 1996.10.15
申请号 JP19960091800 申请日期 1996.03.22
申请人 WACKER JIRUTORONIKU G FUER HARUBURAITAAMATERIARIEN MBH 发明人 KARURU ETSUGURUFUUBERU
分类号 B24B27/06;B23D57/00;B23D59/00;B28D5/04;(IPC1-7):B28D5/04 主分类号 B24B27/06
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