| 摘要 |
<p>PURPOSE: To propagate heat generated by the electronic parts on a package substrate via a lid for cooling by allowing the package substrate and the lid to be made of material with equal thermal coefficient of expansion and providing a cooling fin outside the lid. CONSTITUTION: A ceramic package for a semiconductor consists of a ceramic package substrate 1, a lid 2 made of a material whose thermal coefficient of expansion is equal to that of the package substrate 1, and a cooling in 3 provided outside the lid 2. An electronic part mounting part 7 is provided on the surface of the package substrate 1. The lid 2 seals electronic parts 8 mounted on the electronic part mount part 7. A high heat conductive resin 13 is filled into a space formed between the lid 2, the package substrate 1, and the electronic parts 8 and the high heat conductive material 11 is joined to the inner surface and/or outer surface of the lid 2. Further, the cooling fin 3 is fixed by the high heat conductive adhesive 15, thus properly radiating heat in the package toward the outside.</p> |
