| 摘要 |
PURPOSE: To solve problems which used to happen when a polyimide resin layer of high curing temperature is used as an interlayer insulating film, wherein a conductor wiring mainly formed of Cu low in wiring resistance is used. CONSTITUTION: A first process wherein a conductor wiring layer 12 whose main component is copper is formed on a board 11, and benzocyclobutene resin 13 is applied onto the conductor wiring layer 12, a second process wherein a pattern forming resin layer is formed on the benzocyclobutene resin 13, and a viahole is provided to the benzocyclobutene resin 13, and a third process wherein the benzocyclobutene resin 13 is heated and cured at a temperature of 200 deg.C or so are provided. |
