发明名称 Thermoplastic resin compsn. used to produce materials for packaging, etc.
摘要 A thermoplastic resin (T) comprises: (A) 1-99 wt.% of polyphenylene ether; and (B) 99-1 wt.% of one or more non-crystalline thermoplastic chosen from alkenyl aromatic resins, non-crystalline aromatic polyesters, methacrylates, polyetherimides or aromatic polysulphones. (T) contains 0.001-15 pts. wt. of at least one 4-amino-2,2,6,6-tetramethylpiperidyl cpd. (C) of formula (1) or (2), per 100 pts. (A) and (B). In the formulae, R1 = H, O, OH, (cyclo)alkyl, allyl, benzyl, aryl, alkanoyl, alkenoyl or (cyclo)alkyloxy; R2 = H, alkyl or gp. of formula -R4C(=O)-(-X-)-R5 (3); R3 = n-valent organic gp.; R4 = single bond, alkylene, alkylidene or arylene; R5 = H, alkyl, aryl or gp. of formula -CH=CHC(=O)OH (4) or (5); X = single bond, O or NH; n = 1 - 4; and p = 2 - 6.
申请公布号 DE19607203(A1) 申请公布日期 1996.10.10
申请号 DE19961007203 申请日期 1996.02.26
申请人 SUMITOMO CHEMICAL CO., LTD., OSAKA, JP 发明人 SANADA, TAKASHI, ICHIHARA, CHIBA, JP;ANBO, TAKASHI, ICHIHARA, CHIBA, JP
分类号 C07D211/58;C08K5/3435;C08L67/00;C08L71/00;C08L71/12;C08L79/08;C08L81/06;(IPC1-7):C08L71/12;C08K5/343;C08K5/18;C08K5/10;C08K5/15;C07D401/14 主分类号 C07D211/58
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