| 摘要 |
PURPOSE: To provide cream solder capable of supplying a very small amt. of solder by assuring a specified film thickness and a method for supplying solder. CONSTITUTION: The cream solder capable of supplying the very small amt. of the solder by assuring the specified film thickness is embodied by using only the solder particles having a grain size of 15 to 20[μm] or below as solder particles 3 for forming the cream solder. The cream solder formed by kneading a flux 2 and the solder particles 3 of 15 to 20[μm] or below respectively at prescribed ratios is supplied onto the solder supply positions of an object to be supplied with the solder through the through-holes of a mask provided with the through-holes in correspondence to the solder supply positions of the object to be supplied with the solder, by which the very small amt. of the solder is supplied while the specified film thickness is assured.
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