| 摘要 |
<p>PURPOSE: To accurately control the temperature of a lead frame by a method wherein the temperature of the heated surface of the lead frame in a heater block is detected in a non-contact state, and the temperature of the heater block is controlled based on the signal of the above-mentioned detection. CONSTITUTION: First, before the start of a bonding work, a preset temperature is inputted by the operator using an input part 12. Then, when a wire bonding device 1 is started, a current is applied to a heater 9 by a temperature control device 11, and a heater block 6 is heated up by the heat generating action of the heater block 9. On the other hand, a temperature sensor 10 detects the temperature on the upper surface of a supporting table 8 which constitutes the heater block, and the detected signal is sent to the temperature control device 11. At that time, on the temperature control device, the upper surface temperature of the supporting table 8, which is sensed by the temperature sensor 10, the set temperature are compared, and the current applied to the heater 9 is controlled so that the upper surface temperature is brought closer to the set temperature based on the result of the above-mentioned comparation.</p> |
