| 摘要 |
<p>PURPOSE: To provide a semiconductor manufacturing device with less pick-up errors and less defects on a semiconductor chip when the semiconductor chip is picked up and transferred. CONSTITUTION: The circumference of the dicing sheet 23, attached to the back side of a semiconductor chip 22a is fixed by attraction to the upper surface of a fixing suction holder part 28, and the semiconductor chip 22a is pushed up by the tip part of a push-up member 34 together with the dicing sheet 23 by pivotally moving a pair of push-up members 34. The dicing sheet 23 is stripped off from the semiconductor chip 22a, and the semiconductor chip 22a is picked up by a transfer collet 38. The tip part of the push-up member 34 is directed to the center part from the outer edge part by the pivotal movement or the push-up member 34, the semiconductor chip 22a is pushed up while the dicing sheet 23 is being stretched, and at the same time, the dicing sheet is gradually stripped off from the outer edge part. Finally, the center part only of the semiconductor chip 22a can is brought the state wherein it is bonded by a small adhesive area.</p> |
