| 摘要 |
There is disclosed herein a silicone pressuresensitive adhesive composition which cures upon exposure to ambient moisture. Also disclosed, as a separate embodiment, is a hot-melt silicone pressure-sensitive adhesive composition. These embodiments generally comprise, as a tackifier, an organopolysiloxane resin containing one or more curing radicals and, as a linear siloxane polymer, at least one diorganopolysiloxane polymer containing one or more silicon-bonded hydrolyzable radicals with organic functionality. The weight ratio of said resin to said polymer in our compositions is within the range of 5:95 to 90:10. To these compositions, there is optionally added, as needed, an organic solvent to facilitate application, a catalyst system to cure ingredients, a certain silane and/or fillers. The resultant products formed from our compositons have surprisingly improved strength properties and even exhibit adhesive strengths at elevated temperatures.
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