| 摘要 |
PURPOSE: To provide a semiconductor module wherein the surface of a substrate of an inverter part is filled with cold-setting silicone resin different in viscosity, and insulation and thermal stress are reinforced. CONSTITUTION: A power element and its peripheral circuit are packaged by using a metal substrate and a ceramic substrate, and are collectively formed as a compound component, thereby obtaining a module. The inverter part 4 shown in figure contains the module. The region of the inverter part which requires insulation and the region to which thermal stress is applied are reinforced by using cold-setting silicone resin. A frame is formed by using high viscosity resin, and low viscosity resin is poured inside the frame. The low viscosity silicone resin is poured into the narrow part necessitating insulation and small gaps, thereby serving as a protective case. Since the resin is cured at a normal temperature, the module can be protected as it is without being heated. |
