发明名称 A MOTHERBOARD ASSEMBLY WHICH HAS A SINGLE SOCKET THAT CAN ACCEPT A SINGLE INTEGRATED CIRCUIT PACKAGE OR MULTIPLE INTEGRATED CIRCUIT PACKAGES
摘要 A motherboard assembly (10) which has an integrated circuit socket that can be mated with either a single integrated circuit package or a multiple integrated circuit package module. The motherboard (12) has a socket connector (16) which can receive the external pins (30) of an integrated circuit package (26). The motherboard (12) also has an auxiliary connector (20) that can mate with a corresponding connector (22) mounted to a daughterboard (24). Mounted to the daughterboard (24) are a first integrated circuit package (26) and a second integrated circuit package (28). Each package may contain a multi-processing microprocessor. The first integrated circuit package (26) has a plurality of pins (30) that mate with the socket connector (16). The daughterboard (24) can be coupled to the motherboard (12) by pressing the external pins (30) of the first integrated circuit package (26) into the socket connector (16) and mating the auxiliary connectors (20). The present invention allows a plurality of processors to be plugged into a single socket without occupying a significant amount of space on the motherboard (12).
申请公布号 WO9629848(A1) 申请公布日期 1996.09.26
申请号 WO1996US03679 申请日期 1996.03.18
申请人 INTEL CORPORATION 发明人 BEGIS, GLENN
分类号 G06F13/40;H05K1/14;H05K3/36;H05K7/02;(IPC1-7):H05K1/11;H05K1/16;H05K1/18;H01R9/09;H01R23/68 主分类号 G06F13/40
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