发明名称 Electronic component handling method
摘要 Electronic components are mfd. using several processing and testing stations. The components are handled in between the stations but the handling is minimised due to miniaturisation and to improve quality. The handling is minimised by combining individual process steps. Some of the process steps include Dam bar cut trim and form contacting and electrical testing. The components are placed on one intermediate carrier and moved to a station for final mounting. In the final processing stage the components are loaded into a tub and held there using a plastic strip.
申请公布号 DE19510276(A1) 申请公布日期 1996.09.26
申请号 DE19951010276 申请日期 1995.03.21
申请人 SIEMENS AG, 80333 MUENCHEN, DE 发明人 HAUEIS, NORBERT, 93138 LAPPERSDORF, DE;BROSI, FRANZ, DIPL.-PHYS., MALAKA, ZZ
分类号 H01L21/673;H01L21/68;(IPC1-7):H01L21/68;B65G49/05;H01R33/74 主分类号 H01L21/673
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