| 摘要 |
The present invention relates to a cooling system, especially for electronic components, comprising a hermetically closed pipe conduit including evaporator and condenser and utilizing thermosiphon circulation of the refrigerant used in the pipe conduit, the evaporator being in heat conducting contact with a heat emitting component to be cooled and absorbs heat therefrom, the heat being transported through the pipe conduit by the refrigerant to the condenser and dissipated therein. According to the invention the pipe conduit (3) includes a plurality of evaporators (1a, 1b, 1c) in series, each being in heat conducting contact with a heat emitting component, and the condenser (2) is placed so that the liquid level of the condensed refrigerant is below the uppermost situated evaporator (1c) in the pipe conduit (3). This is rendered possible by the increased pumping action achieved by the evaporators (1a, 1b, 1c) connected together in series in the circulation direction after the evaporators partly evaporated refrigerant used in the pipe conduit (3). |
