发明名称 |
METHOD AND DEVICE FOR MANUFACTURING PRINTED WIRING BOARD |
摘要 |
A wiring pattern forming method in which when the underlying copper foil of the copper wiring pattern is etched, the side-etching of the pattern is small and consequently the wiring resistance increases little. Before removing a resist pattern (3) by use of aqueous remover from a wiring board on which a solder electroplating film (7) is formed on the surface of copper-plating pattern (5) formed on an insulating board (1), dissolved oxygen in the aqueous remover is removed by blowing an intert gas into the remover or adding a reducing deoxydizer to the remover to prevent the solder plating film (7) from dissolving and peeling. Thereafter, the foil (2) and the film (7) are removed to produce an independent copper wiring pattern on the board (1). Since the side etching of the copper wiring pattern can be reduced during the etching of the foil (2), increase of the wiring resistance of the pattern caused by the etching can be prevented.
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申请公布号 |
WO9629849(A1) |
申请公布日期 |
1996.09.26 |
申请号 |
WO1995JP00503 |
申请日期 |
1995.03.20 |
申请人 |
HITACHI, LTD.;KOBAYASHI, SHIROU;MIYAZAKI, MASASHI;TAKADA, TOSHINARI |
发明人 |
KOBAYASHI, SHIROU;MIYAZAKI, MASASHI;TAKADA, TOSHINARI |
分类号 |
H05K3/06;H05K3/10;(IPC1-7):H05K3/24 |
主分类号 |
H05K3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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