发明名称 APPARATUS AND METHOD FOR CONTROLLING HIGH THROUGHPUT SPUTTERING
摘要 A control system for a film deposition apparatus having a plurality of processing chambers. The control system includes a plurality of control processors, each of the plurality of processors including a memory, being coupled to a subset of the plurality of chambers and controlling processing in said subset of the plurality of chambers. Each processor includes a data structure, provided in said memory, having configuration data for said plurality of processing chambers, and control routines for controlling processing in the apparatus. In a second aspect, the system includes a facility for determining the position of the substrate in the system. The transport system of the deposition apparatus includes hardware position sensors which indicate the presence or absence of a subsrate at said sensor. The facility determines the position of substrates when the output of one or more of the hardware sensors is unavailable. The facility determines substrate position based on the output of one or more other sensors which provide a known position of the substrate, encoder data, and the rate of movement of the substrate at each transport stage of the system.
申请公布号 WO9629635(A2) 申请公布日期 1996.09.26
申请号 WO1996US03729 申请日期 1996.03.19
申请人 SEAGATE TECHNOLOGY, INC. 发明人 EASTBURN, LINDSEY;MASS, LEON
分类号 C23C14/34;C23C14/54;C23C14/56;G05B15/02;G05B19/418;H01L21/203 主分类号 C23C14/34
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