发明名称 |
Electronic package with improved electrical performance |
摘要 |
An electronic package having improved electrical properties in which a plastic Quad Flat Pack is provided with upper and lower metallic plates encased in the plastic body and overlapping at least a portion of the length of the encased portion of the leads whereby the self and mutual inductance of the package is reduced. A ceramic Quad Flat Pack is provided with metal plates attached to the mating surfaces of the ceramic cover component and the ceramic base component so that at least a portion of the enclosed portion of the leads which are electrically connected to the electronic component inside the components is overlapped on the top and bottom by the metallic plates.
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申请公布号 |
US5559306(A) |
申请公布日期 |
1996.09.24 |
申请号 |
US19950540835 |
申请日期 |
1995.10.11 |
申请人 |
OLIN CORPORATION |
发明人 |
MAHULIKAR, DEEPAK |
分类号 |
H01L23/16;H01L23/31;H01L23/433;H01L23/552;H01L33/48;H01L33/64;(IPC1-7):H01L23/02 |
主分类号 |
H01L23/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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