| 摘要 |
A hermetically sealed surface mount diode package composed of: a support member of electrically conductive material; a diode element having two mutually opposed surfaces constituting, respectively, cathode and anode contact surfaces, the element resting on the support member so that one of the surfaces is in contact with the support member; an electrical contact member for conductively contacting the other one of the surfaces of the diode member, the contact member having a frame portion which surrounds the diode and a connection portion enclosed by the frame portion and conductively connected to the other one of the surfaces; a frame member of electrical insulating material surrounding the diode and interposed between, and secured to, the support member and the frame portion to form a hermetic seal with the support member and the frame portion; and a cover plate of electrically conductive material disposed on, secured to, and forming a hermetic seal with, the frame portion, wherein the support member, the frame portion, the frame member and the cover plate form a hermetically sealed space enclosing the diode.
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