| 摘要 |
<p>A heat-treating apparatus (1) comprising a chamber (4) for containing a plurality of substrates (W) to be treated, and heatshields (19) around the substrates to protect their edges from heat radiation incident at a perdetermined angle of υ from heaters. Generally, a greater angle of incidence of heat radiation causes more damage to the edges of substrates (W). The heatshields (19), which cut off heat radiation incident at an angle exceeding the predetermined angle of incidence (υ), limit the adverse effects of heat radiation on the edges of the substrates (W). As a result, the temperature can be raised and lowered quickly inside the heat-treating chamber (4) not only at a normal pressure but also at a reduced pressure by sufficiently reducing the inplane temperature difference between the central portion and the peripheral portion of the substrates (W), and through-put can be improved.</p> |
