发明名称 Klebefolie und Verfahren zum Verbinden von Elementen mit kleinen Löchern
摘要 A method of bonding together two members (1, 2) each having small holes (11, 21), the method comprising the steps of provisionally bonding by pressurizing onto the contact surface of one of the members (1, 2) each having small holes a sheet-shaped adhesive member (3) including escape holes (31) respectively corresponding to the small holes (11, 21) and deformation preventive holes (32) for preventing the escape holes (31) from being deformed, and bonding by heating and pressurizing the other member onto the contact surface. <IMAGE>
申请公布号 DE69209585(T2) 申请公布日期 1996.09.19
申请号 DE1992609585T 申请日期 1992.08.21
申请人 SEIKO EPSON CORP., TOKIO/TOKYO, JP 发明人 MOROZUMI, MASAYUKI, C/O SEIKO EPSON CORPORATION, SUWA-SHI, NAGANO, JP;TAKIZAWA, AKIRA, C/O SEIKO EPSON CORPORATION, SUWA-SHI, NAGANO, JP
分类号 B29C65/50;B29L7/00;B41J2/16;C09J5/06;C09J7/00;C09J7/02;F16B11/00;(IPC1-7):B41J2/16 主分类号 B29C65/50
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